IC Packaging Mechanical Engineer

  • New Providence
  • Acceler8 Talent
<strong>IC Packaging Mechanical Design Engineer - (New Providence, NJ)</strong><br><br>Join a growing engineering team and develop cutting-edge optical modules for high-performance computing. <br><br><strong>Responsibilities:</strong><br><ul><li>Design innovative packaging solutions for optical modules</li><li>Develop testing procedures and ensure product reliability</li><li>Troubleshoot technical challenges in packaging and materials</li><li>Build and maintain component models and technical drawings</li><li>Collaborate with internal and external teams for seamless integration</li></ul><br><strong>Qualifications:</strong><br><ul><li>BS in Mechanical Engineering</li><li>2+ years of IC package design experience Or Ph.D. in Mechanical Engineering </li><li>Excellent communication skills</li></ul><br><strong>Preferred Skills:</strong><br><ul><li>SolidWorks (PDM) & FEA tools (ANSYS Mechanical)</li><li>Rapid prototyping (Formlabs 3D printing a plus)</li><li>Design for manufacturing (CNC, casting, MIM)</li><li>Optical module reliability (Telcordia GR-468)</li><li>Advanced IC packaging technologies (3D/2.5D IC, FOWLP, MCM FC-BGA)</li><li>High-speed test socket and connector experience</li></ul>